Disclosed is a tablet computer mainboard. The tablet computer mainboard comprises a circuit board, sockets and electronic components, and also comprises heat dissipation fins and a water-cooling assembly. The heat dissipation fins are located on the back surface of the circuit board, and the heat dissipation fins and the circuit board are in a threaded connection. The water-cooling assembly comprises a micro air pump and water pipes. The micro air pump is located on the back surface of the circuit board. The micro air pump and the circuit board are in a threaded connection. The water pipes are located among the heat dissipation fins, the water pipes and the heat dissipation fins are connected by means of buckles. Rubber pads are mounted in recesses on four corners of the outer side, provided with the heat dissipation fins, of the circuit board of the tablet computer mainboard, and accordingly gaps are formed between the circuit board and the heat dissipation fins. In addition, spacers of the heat dissipation fins are in an S shape, buckles are mounted at the S-shaped recessed position, and a round hole is formed at a raised position. The water pipes are fixed by means of the buckles. The round holes run through and are densely distributed on the heat dissipation fins. Pure water is filled in the water pipes. By means of the micro air pump, rapid circulation and cooling are implemented, the air outlet and the air inlet of the air pump are provided with filtering screens fixed by hoops, so as to implement double-layer purification, thereby ensuring smooth internal circulation in the water pipes and achieving the effect of continuous, rapid, and silent heat dissipation.
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