THREE-DIMENSIONAL INDUCTANCE COIL AND METHOD FOR PREPARING THREE-DIMENSIONAL INDUCTANCE COIL USING PRINTED CIRCUIT METHOD

摘要

Provided are a three-dimensional inductance coil and a method for preparing a three-dimensional inductance coil using a printed circuit method. The method comprises the following steps: 1) drilling two opposite faces, attached with copper foils, of a double-faced copper-clad plate (3), so as to form two columns of through holes (11, 21); 2) cleaning walls of the through holes; 3) depositing metallic copper layers on the walls of the through holes; 4) filling copper in the through holes, so as to form first and second columns of copper cylinders (4, 5); and 5) sticking photosensitive dry films on the two faces, attached with the copper foils, of the double-faced copper-clad plate (3), performing exposure and development, imaging the photosensitive dry films, and then performing etching, wherein after etching, the double-faced copper-clad plate (3) only remains the first and second columns of copper cylinders (4, 5), and a plurality of upper connecting strips (6) and a plurality of lower connecting strips (7) which are separated from each other, the top of the (1+n)^th copper cylinder in the first column of copper cylinders (4) is connected to the top of the n^th copper cylinder in the second column of copper cylinders (5) by means of one upper connecting strip (6), and the bottom of the n^th copper cylinder in the first column of copper cylinders (4) is connected to the bottom of the n^th copper cylinder in the second column of copper cylinders (5) by means of one lower connecting strip (7). The method features high efficiency.