首页> 外国专利> METHOD FOR MANUFACTURING THIN PLATE HAVING HEATING AND AMORPHOUS CHARACTERISTICS THROUGH PLATING

METHOD FOR MANUFACTURING THIN PLATE HAVING HEATING AND AMORPHOUS CHARACTERISTICS THROUGH PLATING

机译:通过镀层制造具有加热和非晶特性的薄板的方法

摘要

The present invention relates to a low-temperature bonding method for a low-temperature bonding brazing alloy. The present invention comprises a low-temperature bonding method for a low-temperature bonding brazing alloy. In addition, the present invention comprises a method for manufacturing a thin plate through plating, the method comprising: a step of preparing a water-based alloy plating solution comprising at least two metallic salts including a first metallic salt and a second metallic sa an electrode preparation step for preparing an anode and a cathode, the cathode being selected from among metals forming passive films and being prepared by attaching a peeling assist tape having a resistance against to acid or alkali; a step of configuring an electroplating circuit by immersing the anode and the cathode into the water-based alloy plating solution; a step of applying a reduction potential or current to the anode or the cathode by inputting, to a control unit for controlling the electroplating circuit, the value of a voltage between +2 V and -4.5 V or a current corresponding thereto on the basis of a 25°C standard hydrogen electrode according to the value of the reduction potential of the metallic salts to be plated; a step of forming at least two multilayered amorphous metallic plating films on the cathode due to the standard reduction potential difference between the metallic salts; and a step of obtaining a thin plate by removing the peeling assist tape from the cathode and separating the at least two multilayered amorphous metallic plating films, followed by washing and drying. The present invention enables a low-temperature process by replacing foil, filler, powder and paste used in brazing. Therefore, it is possible to reduce substrate damage or defects a due to heat generated from brazing, and there is an effect of contributing to energy saving because the process is performed at low temperatures.
机译:本发明涉及一种用于低温粘结钎焊合金的低温粘结方法。本发明包括用于低温粘结钎焊合金的低温粘结方法。另外,本发明包括通过镀覆制造薄板的方法,该方法包括:制备包含至少两种金属盐的水基合金镀覆溶液的步骤,所述金属盐包括第一金属盐和第二金属盐;和电极制备步骤,用于制备阳极和阴极,该阴极选自形成钝化膜的金属,并且通过粘贴对酸或碱具有抵抗力的剥离辅助带来制备。通过将阳极和阴极浸入水基合金镀液中来配置电镀电路的步骤;通过将+ 2V至-4.5V之间的电压值或与之相对应的电流值输入至用于控制电镀电路的控制单元,来向阳极或阴极施加还原电势或电流的步骤。根据待镀金属盐还原电位的值,在25℃标准氢电极下;由于金属盐之间的标准还原电位差,在阴极上形成至少两个多层非晶态金属镀膜的步骤;通过从阴极上除去剥离辅助带并分离至少两个多层的非晶态金属镀膜,然后进行洗涤和干燥来获得薄板的步骤。本发明通过代替钎焊中使用的箔,填料,粉末和糊剂而能够进行低温处理。因此,可以减少由于钎焊产生的热量引起的基板损伤或缺陷a,并且由于该处理在低温下进行,因此具有节能的效果。

著录项

  • 公开/公告号WO2017018749A1

    专利类型

  • 公开/公告日2017-02-02

    原文格式PDF

  • 申请/专利权人 DUKSAN HIGH METAL CO. LTD.;

    申请/专利号WO2016KR08064

  • 发明设计人 JUNG JAE PIL;LEE JUN HYEONG;

    申请日2016-07-22

  • 分类号C25D3/02;C25D5/10;C25D5/48;C25D17/10;C25D17/12;C25D3/04;C25D3/10;C25D3/20;C25D3/22;C25D3/32;

  • 国家 WO

  • 入库时间 2022-08-21 13:32:25

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