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OPTICAL COUPLING ADAPTOR FOR OPTICAL SIGNAL COUPLING BETWEEN PHOTONIC INTEGRATED CIRCUIT AND OPTICAL FIBER

机译:光子集成电路与光纤维之间光信号耦合的光耦合适配器

摘要

An optical coupling adaptor (10) couples an optical fiber to a photonic integrated circuit (PIC) chip (40). The adaptor (10) once connected to the PIC chip (40) forms a chip-adaptor assembly. The photonic integrated circuit (PIC) chip (40) has a plurality of inverted taper waveguides having an enlarged optical mode. The optical coupling adaptor (10) has a first section (20) having a plurality of ridge waveguides (24) between layers of cladding and also separated laterally by cladding and a second section (30) abutting the first section (20), the second section (30) having a plurality of trenches (34) each filled with an optical polymer that once cured has a refractive index that matches that of the ridge waveguides (24). The optical coupling adaptor (10) is adhered to the PIC chip (40) using the optical polymer as an adhesive such that the optical polymer in the trenches (34) once cured form polymer waveguides that confine the enlarged mode of the inverted taper waveguides.
机译:光耦合适配器(10)将光纤耦合到光子集成电路(PIC)芯片(40)。适配器(10)一旦连接到PIC芯片(40),便形成芯片适配器组件。光子集成电路(PIC)芯片(40)具有多个倒锥形的波导,其具有扩大的光学模式。光耦合适配器(10)具有第一部分(20),该第一部分(20)在包层之间具有多个脊形波导(24),并且也通过包层横向分开,第二部分(30)邻接第一部分(20),第二部分部分(30)具有多个沟槽(34),每个沟槽(34)填充有光学聚合物,该光学聚合物一旦固化,其折射率与脊形波导(24)的折射率匹配。使用光学聚合物作为粘合剂将光耦合适配器(10)粘贴到PIC芯片(40)上,这样,一旦固化,沟槽(34)中的光学聚合物就形成了聚合物波导,该聚合物波导限制了倒锥形波导的扩大模式。

著录项

  • 公开/公告号WO2017054683A1

    专利类型

  • 公开/公告日2017-04-06

    原文格式PDF

  • 申请/专利权人 HUAWEI TECHNOLOGIES CO. LTD.;

    申请/专利号WO2016CN99998

  • 发明设计人 JIANG JIA;

    申请日2016-09-24

  • 分类号G02B6/26;G02B6/36;G02B6/42;

  • 国家 WO

  • 入库时间 2022-08-21 13:31:33

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