3D SPECTRACOUSTIC SYSTEM: A MODULAR, TOMOGRAPHIC, SPECTROSCOPIC MAPPING, NON- INVASIVE IMAGING DIAGNOSTIC SYSTEM

摘要

The current patent is aiming to describe the combined use of high frequency ultrasonic and photonic technologies in the infrared area of the spectrum through the use of a common probe. This common probe can excite the under diagnosis/ study object using both the modalities simultaneously or in serial mode resulting to the acquisition of the tomographic information from the object as well as its spectroscopic reflectance/ absorbance information in the infrared area of the spectrum. The combination of the two technologies can be called as spectracoustic method.