MICROSCOPIC THREE-DIMENSIONAL STRUCTURE FORMING METHOD, AND MICROSCOPIC THREE-DIMENSIONAL STRUCTURE

摘要

The present invention addresses the problem of forming, rapidly and faithfully to a design, a microscopic three-dimensional structure carved in a vertical direction and having smooth side surfaces at low cost. As a solution, a microscopic three-dimensional structure forming method is provided, comprising: the step (1) of forming a resist pattern drawn on a substrate by mask-less exposure; an isotropic etching step (2A) of forming a recess in the substrate by isotropic etching; a plasma deposition step (2B) of depositing a protective film on the resist pattern and the inner walls of the recess; a removal step (2C) of removing the protective film on the bottom surface of the recess by anisotropic etching; and the step (2) of sequentially reiterating the isotropic etching step (2A), the plasma deposition step (2B) and the removal step (2C), thereby forming a microscopic depression in the substrate.