Provided is a device for producing a composite three-dimensional shape electronic module by using 3D printing technology. The device comprises: a body unit having a head unit including a resin spraying nozzle head and a conductive material spraying nozzle head; a structure forming unit having a first resin feeder for supplying a first resin including a seed forming agent by being connected with the resin spraying nozzle head through a first resin supply line as a medium, and forming a first structure by a first resin hardened by being sprayed through the resin spraying nozzle head; a first patter circuit forming unit having a laser irradiating unit for irradiating laser to the surface of the first structure, and forming a seed layer on the first structure according to a predetermined pattern circuit; and a second pattern circuit forming unit having at least one conductive material feeder for supplying a conductive material by being connected with the conductive material spraying nozzle head through a conductive material supply line as a medium, and forming a circuit forming conductive layer by a conductive material sprayed to the seed layer.
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