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NON-CYANOGEN TYPE ELECTROLYTIC GOLD PLATING SOLUTION

机译:非氰型电解金镀液

摘要

The present invention provides a non-cyanogen electrolytic gold plating solution capable of forming a plating film capable of maintaining high hardness, even when heat treatment is performed. The present invention relates to an electrolytic solution containing at least one of iridium, ruthenium and rhodium in a bcciene electrolytic gold plating solution containing a gold source comprising a gold sulfite gold salt or gold sulfite gold and a conductive salt comprising a sulfite and a sulfate, Is contained in an amount of 1 to 3000 mg / L as a metal concentration. It is preferable to further contain a crystal adjusting agent, and thallium is particularly preferable.
机译:本发明提供了一种即使在进行热处理时也能够形成能够维持高硬度的镀膜的非氰化物电解金镀液。本发明涉及在二苯并electrolytic电解镀金溶液中包含铱,钌和铑中的至少一种的电解液,该c并苯电解镀金溶液包含包含亚硫酸金金盐或亚硫酸金金的金源以及包含亚硫酸盐和硫酸盐的导电盐,所含金属量为1至3000 mg / L。优选进一步包含晶体调节剂,特别优选th。

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