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NON-CYANOGEN TYPE ELECTROLYTIC GOLD PLATING SOLUTION
NON-CYANOGEN TYPE ELECTROLYTIC GOLD PLATING SOLUTION
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机译:非氰型电解金镀液
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摘要
The present invention provides a non-cyanogen electrolytic gold plating solution capable of forming a plating film capable of maintaining high hardness, even when heat treatment is performed. The present invention relates to an electrolytic solution containing at least one of iridium, ruthenium and rhodium in a bcciene electrolytic gold plating solution containing a gold source comprising a gold sulfite gold salt or gold sulfite gold and a conductive salt comprising a sulfite and a sulfate, Is contained in an amount of 1 to 3000 mg / L as a metal concentration. It is preferable to further contain a crystal adjusting agent, and thallium is particularly preferable.
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