- / / The bonding adhesive composition for bonding at high and low temperature and method for improving of bonding characteristics between alpha alumina/beta alumina and alpha alumina/metal in Na-S battery

摘要

When a conventional high melting point metal is used in similar bonding of alpha and beta alumina of a sodium-sulfur battery or in dissimilar bonding between dissimilar materials, such as alpha alumina and a metal, a relatively expensive apparatus is required; and the process is complex. According to the present invention, to make up for the drawbacks of bonding between dissimilar materials in a thermal compression bonding (TCB) method at a high temperature, a metal composite bonding material, a metal bonding material to be bonded at low temperatures between 600 to 1100 degrees is invented. Also, to improve bonding properties, nickel is bonded to the surface of alpha alumina by electroless plating. In addition, for similar bonding, a bonding material is invented with a glass composition to be used at a high temperature or a low temperature, which is a dissimilar bonding temperature and a bonding temperature in an order of bonding earlier or later than dissimilar bonding. Moreover, as a large amount of micropores are produced by acid-treating beta alumina of a bonding unit, or a bonding unit of alpha and beta alumina is coated with a bonding gasket component before bonding, and then the bonding is performed, a method for improving the bonding performance is invented. Therefore, as bonding temperature becomes low, similar bonding and dissimilar bonding are possible in a simplified process, and the bonding performance is improved due to pretreatment of similar and dissimilar materials.