POSITIONAL PRECISION INSPECTION METHOD POSITIONAL PRECISION INSPECTION DEVICE AND POSITION INSPECTION UNIT

摘要

The inspection of the contact position at the time of conducting the contact type inspection of the inspection chip formed on the substrate to be inspected is simply and accurately performed. The probing positions of the probe needles with respect to the electrode pads 71 to 75 of the semiconductor device are inspected in advance when inspecting the probes of the semiconductor devices formed on the wafers W arranged on the stage 11. A reticle 31 in which figures 61 to 65 indicating the positions of probe needles are formed is disposed at a position where the probe needles are placed and a semiconductor device formed on the wafer W is picked up through the reticle 31 And the positional relationship between the figure formed on the reticle 31 and the electrode pads 71 to 75 is analyzed from the image picked up by the element 33. [ The position of the stage 11 is corrected so as to match the centers of the figures 61 to 65 and the centers of the electrode pads 71 to 75 as necessary.