Rapid curing epoxy resin and prepreg obtained therefrom

摘要

The present invention relates to a composition comprising a semi-solid epoxy resin containing a curing agent dispersed therein. The curing agent has a particle size such that at least 90% of the particles have a size of less than 25 占 퐉 at an ambient temperature of 21 占 폚, and the composition further comprises a diluent containing a particulate filler. The composition is used as a matrix in a prepreg. The use of a diluent increases the peel strength of the composition when brought into contact with a metal or wood substrate.