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- Wafer-level lenses module with an extended depth of field and imaging device including the lenses module

机译:-具有更大景深的晶圆级镜头模块和包括镜头模块的成像设备

摘要

Disclosed herein is a wafer-level extended depth of field (EDOF) lens module and an imaging apparatus having the same. The wafer-level focal depth extension lens module includes a plurality of wafer-scale lenses stacked at predetermined intervals. The plurality of wafer-scale lenses includes an effective lens whose profile is modified from an aspheric lens. The ray passing through the central region is focused on an infinite image, The profile of the effective lens is corrected so as to form an image centered on the image in the macro-macro. For example, the corrected effective lens has a first portion with no change in lens shape, a second portion with negative error, and a third portion with positive error from the optimized aspheric lens, Can be defined sequentially.
机译:本文公开了晶片级扩展景深(EDOF)透镜模块和具有该透镜模块的成像设备。晶片级焦深扩展透镜模块包括以预定间隔堆叠的多个晶片级透镜。多个晶片级透镜包括有效透镜,其轮廓由非球面透镜修改而成。穿过中心区域的光线聚焦在无限大的图像上。有效透镜的轮廓被校正,从而在宏观宏中形成以图像为中心的图像。例如,可以顺序地定义来自优化的非球面透镜的校正后的有效透镜的第一部分的透镜形状没有变化,具有负误差的第二部分和具有正误差的第三部分。

著录项

  • 公开/公告号KR101737091B1

    专利类型

  • 公开/公告日2017-05-18

    原文格式PDF

  • 申请/专利权人 삼성전자주식회사;

    申请/专利号KR20100019155

  • 发明设计人 이승완;이정엽;김운배;

    申请日2010-03-03

  • 分类号G02B13;G02B3/14;H04N5/225;

  • 国家 KR

  • 入库时间 2022-08-21 13:25:30

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