EMC Electromagnetic compatibility module of combined line filter using multi-layer board

摘要

The present invention relates to an electromagnetic compatibility (EMC) module convertible to a line filter using a multilayer board. More specifically, the present invention is capable of realizing the same performance of parts and mass production of the same product, by replacing a conventional wire-shaped metal wire with a multilayer printed circuit board. An inductor and a capacitor component having an inductance and a capacitance value are added to the performance of a simple line filter, thereby achieving the performance of an electromagnetic interference (EMI) filter. Also, the present invention can cope with various frequency characteristics by adjusting the inductance and capacitance value of the inductor and the capacitor component, and can be manufactured in an ultra-slim shape, by replacing the wire-shaped metal wire with the multilayer printed circuit board, because the present invention does not need a bobbin which acts as a support for winding the metal wire. In addition to being capable of minimizing workforce and equipment in manufacturing the EMC module convertible to the line filter, automatic production is possible, and one or two stages can be selectively located to a power input terminal and a power output terminal depending on the type of the inductor being used, then transmitted without loss to the current and voltage in a power input circuit, and acting as a high impedance resistor with respect to a high frequency noise to eliminate the noise. After a metal wire and an insulating layer are repeatedly laminated to form a metal wire pattern of the printed circuit board (PCB), a core can be made so that the voltage capacity can be changed according to the number of times of lamination, and various types of cores can be applied.