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HEADPHONE CONNECTOR, HEADPHONE PLUG, HEADPHONE AND ELECTRONIC DEVICE

机译:耳机连接器,耳机插头,耳机和电子设备

摘要

FIELD: physics.;SUBSTANCE: headphone connector comprises a connector body, in which the headphone jack is formed, and a plurality of the ground terminals, which are located in the headphone jack and contact the section located on the headphone plug, when the headphone plug is inserted into the headphone jack. Herewith the plurality of the ground terminals are located uniformly along the circumferential direction of the headphone jack, and each of the ground terminals comprises a common ground structure on the inner headphone jack wall, a head section, which contacts with the headphone plug, when the headphone plug is inserted into the headphone jack, and a resilient mechanism is inserted between the common ground structure and the head section. Furthermore, the head section of each of the ground terminals is a spherical metal structure, and the common ground structure is an annular metal structure located on the inner headphone jack wall.;EFFECT: reducing the headphone crosstalk coming from the main device board such as a smart terminal, by increasing the contact area of the ground terminals between the headphone plug and the headphone connector, that reduces the contact resistance between the headphone plug and the headphone connector.;7 cl, 10 dwg
机译:技术领域:物理领域;实质:耳机连接器包括:连接器主体,形成耳机插孔;以及多个接地端子,接地端子位于耳机插孔中,并在耳机连接时与位于耳机插头上的部分接触。插头插入耳机插孔。因此,多个接地端子沿着耳机插孔的圆周方向均匀地定位,并且每个接地端子包括位于耳机插孔内壁上的公共接地结构,即当耳机插孔与耳机插头接触时的头部。耳机插头插入耳机插孔,弹性机构插入公共接地结构和头部之间。此外,每个接地端子的头部都是球形金属结构,公共接地结构是位于耳机插孔内壁上的环形金属结构。;效果:减少来自主机板等耳机的串扰通过增加耳机插头和耳机连接器之间的接地端子的接触面积的智能端子,可以减小耳机插头和耳机连接器之间的接触电阻。; 7 cl,10 dwg

著录项

  • 公开/公告号RU2618512C2

    专利类型

  • 公开/公告日2017-05-04

    原文格式PDF

  • 申请/专利权人 SYAOMI INK.;

    申请/专利号RU20150129516

  • 发明设计人 LI KHOJ (CN);SUN VEJ (CN);FAN TSZE (CN);

    申请日2015-04-29

  • 分类号H01R24/58;

  • 国家 RU

  • 入库时间 2022-08-21 13:23:36

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