首页> 外国专利> Optimization device for an electronics housing and computer-readable recording medium in which an optimization program for an electronics housing is recorded

Optimization device for an electronics housing and computer-readable recording medium in which an optimization program for an electronics housing is recorded

机译:用于电子设备壳体的优化装置和计算机可读记录介质,其中记录了用于电子设备壳体的优化程序

摘要

An electronics housing optimizing apparatus, comprising: a whole analysis model generating unit that generates first mesh data for performing analysis of an electronic package by dividing each component constituting the electronic package into a plurality of meshes based on design data of the electronic package including Has solder connection area; an overall analysis execution unit that performs an analysis of the electronics housing by using the first mesh data generated by the whole analysis model generating unit; an extraction unit for a target connection area that extracts a target connection area based on an analysis result obtained by the execution unit for overall analysis; a detail analysis unit that performs a more accurate analysis than that performed by the total analysis execution unit for the target-connection-area extracted by the target-connection-area-extracting unit; a lifetime optimizing unit which changes the design data of the electronic package so that the life calculated as an analysis result obtained by the detail analysis unit of the electronic package falls within a predetermined range; wherein the whole analysis model generating unit generates a solder terminal area model having the same volume, height and land as the volume, height and land of the solder land area, wherein the solder land area model is a polyhedron, and divides the solder land area model into a plurality of meshes, whereby the first mesh data The optimization unit for a lifetime through an experiment design is a ...
机译:一种电子设备外壳优化装置,包括:整体分析模型生成单元,其基于包括具有焊料的电子封装的设计数据,通过将构成电子封装的每个组件划分为多个网格来生成用于执行电子封装分析的第一网格数据。连接区域;整体分析执行单元,其通过使用由整个分析模型生成单元生成的第一网格数据来对电子设备壳体进行分析;用于目标连接区域的提取单元,其基于执行单元获得的用于整体分析的分析结果来提取目标连接区域;详细分析单元,对于由目标连接区域提取单元提取的目标连接区域,进行比总分析执行单元进行的分析更准确的分析;寿命优化单元,其改变电子封装的设计数据,使得作为由电子封装的细节分析单元获得的分析结果而计算出的寿命落入预定范围内;其中,整个分析模型生成单元生成具有与焊料焊盘区域的体积,高度和焊盘相同的体积,高度和焊盘的焊料端子区域模型,其中焊料焊盘区域模型是多面体,并且划分焊料焊盘区域将模型建模成多个网格,从而将第一个网格数据通过实验设计的生命周期优化单元是...

著录项

  • 公开/公告号DE112005003503B4

    专利类型

  • 公开/公告日2017-06-08

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD.;

    申请/专利号DE20051103503T

  • 申请日2005-03-18

  • 分类号G06F17/50;

  • 国家 DE

  • 入库时间 2022-08-21 13:23:15

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号