Method for releasing a connection between a thin-walled component and an object and heating device connected to this thin-walled component by means of an adhesive layer

摘要

Method for releasing a connection between a thin-walled component (10) formed at least in a partial region and an object (26) connected to the component (10) by means of an adhesive layer, characterized in that the component (10) is provided with a heating device (32), comprising a heating mat (50) made of a flexible to a temperature of at least 200 ° C temperature-stable, flexible material and at least one of the heating mat (50) enclosed heating element (52) in the form of a heat conductor, by direct contact and heat input in the at least one thin-walled formed portion is heated such that due to the heating of the portion and an adhesive to the component (10) adjacent adhesive layer is heated to a temperature at which the holding forces of the adhesive layer, which hold the component (10) with the object (26) reduced or completely canceled, and then the component (10) is separated from the object (26).