Thermal interface material with defined thermal, mechanical and electrical properties

摘要

An electronic component (100) comprising an electrically conductive carrier (102), an electronic chip (104) on the carrier (102), an encapsulation means (106) encapsulating a portion of the carrier (102) and the electronic chip (104) and an electrically insulating and thermally conductive interface structure (108), in particular for covering an exposed surface portion of the carrier (102) and a connected surface portion of the encapsulation means (106), wherein the interface structure (108) has a compressibility in a range between 1% and 20%. , in particular in a range between 5% and 15%.