leiterbahnenstruktur with a schwingungsgedu00e4mpft recorded component

摘要

leiterbahnenstruktur with a du00e4mpfungseinrichtung for a component, especially for an electronic or electro-mechanical and, in particular, a mikroelektronisches componentthe at least one body (10, 10 ') from a carrier material (11; 11') and a anschlussbereich (2) to absorb the vibration and / or vibration component (b) isthe intrinsic du00e4mpfungsvorrichtung (20) of the leiterbahnenstruktur (1) below, characterizedthe intrinsic du00e4mpfungsvorrichtung (20) by at least one layer (21; 22) from a dampening material, in particular from a dampening adhesive, is trainedand that such trained intrinsic du00e4mpfungsvorrichtung (20) between the anschlussbereich (2) and that (2) surrounding the area of grundku00f6rpers (10, 10 ') is arranged.