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Cover with a metallic grid modled into non-metallic structure and processing method thereof
Cover with a metallic grid modled into non-metallic structure and processing method thereof
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机译:具有被改造成非金属结构的金属格栅的盖及其处理方法
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摘要
An electronic device (100) is provided including a plurality of electronic parts; one or more housing components (210,220) forming a space for receiving the plurality of electronic parts; and a cover (230) detachable from the one or more housing components (210,220), the cover (230) including a first member (231) having a plurality of metal elements (5311) suspended in a non-metal base (5320) and a second member (232) coupled to the first member (231).
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