首页> 外国专利> Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member

Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member

机译:用于热源元件和导热构件的固定结构,以及固定热源元件和导热构件的方法

摘要

The present invention discloses a fixing structure for a heat source element, which is mounted on a circuit board accommodated in a housing, and a heat conducting member, which is accommodated in the housing, the fixing structure being configured to fix the heat source element and the heat conducting member to each other with the heat source element and the heat conducting member in abutment with each other, wherein the heat conducting member is moved toward the heat source element along a direction that is generally orthogonal to a surface of the heat conducting member for abutment with the heat source element to be brought into abutment with the heat source element; the heat source element and the heat conducting member, which have been brought into abutment with each other, are held by an elastic member to fix the heat source element and the heat conducting member to each other.
机译:本发明公开了一种用于热源元件的固定结构,该固定结构安装在容纳在壳体中的电路板上;以及导热构件,其容纳在壳体中,该固定结构被构造为固定热源元件,并且导热构件彼此接触,并且导热构件和导热构件彼此邻接,其中导热构件沿着大致正交于导热构件的表面的方向朝向导热构件移动。用于与热源元件邻接,以与热源元件邻接;彼此抵接的热源元件和导热构件由弹性构件保持,以将热源元件和导热构件彼此固定。

著录项

  • 公开/公告号EP2461660A3

    专利类型

  • 公开/公告日2017-12-27

    原文格式PDF

  • 申请/专利权人 AISIN AW CO. LTD.;

    申请/专利号EP20110189496

  • 发明设计人 TAKA YOICHIRO;TAKANO MASASHI;AIKAWA TAROU;

    申请日2011-11-17

  • 分类号H05K7/20;

  • 国家 EP

  • 入库时间 2022-08-21 13:19:52

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