首页> 外国专利> DEVICE HAVING A POWER ELECTRONICS MODULE FOR SUPPLYING AN ELECTRIC LOAD OF A HOUSEHOLD APPLIANCE WITH ELECTRICAL SUPPLY VOLTAGE, HOUSEHOLD APPLIANCE, AND METHOD FOR PRODUCING SUCH A DEVICE

DEVICE HAVING A POWER ELECTRONICS MODULE FOR SUPPLYING AN ELECTRIC LOAD OF A HOUSEHOLD APPLIANCE WITH ELECTRICAL SUPPLY VOLTAGE, HOUSEHOLD APPLIANCE, AND METHOD FOR PRODUCING SUCH A DEVICE

机译:具有具有用于为具有家用电器电源的家用电器供电的功率电子模块的设备,家用电器以及用于制造这种设备的方法

摘要

The invention relates to a device (1) for supplying an electrical load of a household appliance with electrical supply voltage, comprising a power electronics module (2), which has a hybrid circuit board (3) having a first circuit carrier (4) and a second circuit carrier (5), wherein a transition region (19) between the first and the second circuit carrier (4, 5) has a lower heat conductivity with respect to the first and/or the second circuit carrier (4, 5), and comprising a temperature protection device for the temperature protection of the power electronics module (2). On the first circuit carrier (4) of the hybrid circuit board (3), at least one semiconductor switch (6) is arranged, which is configured for generating the supply voltage for the electrical load. On the second circuit carrier (5) of the hybrid circuit board (3), a temperature sensor (8) of the temperature protection device for detecting a temperature is arranged, to which the at least one semiconductor switch (6) is subjected during the operation of the device (1). On the power electronics module (2), a thermally conductive foil (13) is arranged, by way of which the at least one semiconductor switch (6) and the temperature sensor (8) are thermally coupled to one another.
机译:用于向家用电器的电负载供应电源电压的装置(1),包括一种功率电子模块(2),该功率电子模块具有混合电路板(3),该混合电路板具有第一电路载体(4),以及第二电路载体(5),其中,第一和第二电路载体(4、5)之间的过渡区域(19)相对于第一和/或第二电路载体(4、5)具有较低的导热性包括温度保护装置,用于对功率电子模块(2)进行温度保护。在混合电路板(3)的第一电路载体(4)上,布置至少一个半导体开关(6),该半导体开关被构造用于产生用于电负载的供电电压。在混合电路板(3)的第二电路载体(5)上,布置有用于检测温度的温度保护装置的温度传感器(8),在温度检测期间,至少一个半导体开关(6)经受该温度传感器的作用。设备的操作(1)。在功率电子模块(2)上布置有导热箔(13),通过该导热箔将至少一个半导体开关(6)和温度传感器(8)彼此热耦合。

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