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METHOD OF DRILLING A HOLE IN A COMPONENT WITH A LASER HAVING LAYERS USING PULSE IN THE MILLISECOND RANGE AND HAVING VARYING ENERGY OVER TIME
METHOD OF DRILLING A HOLE IN A COMPONENT WITH A LASER HAVING LAYERS USING PULSE IN THE MILLISECOND RANGE AND HAVING VARYING ENERGY OVER TIME
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机译:在微距范围内利用脉冲在具有激光加工层的组件中钻孔的方法,并且随着时间的推移变化能量
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摘要
There is described herein a method OF and system for drilling holes in components (300) having multiple layers of materials using a laser emitting device (302) in combination with a control unit (304), by controlling the laser pulses in such a way that cracks at the interfaces between the various materials are minimized or eliminated.
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