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METHOD FOR ELECTROLYTIC SURFACE MODIFICATION OF FLAT METAL WORKPIECES IN COPPER-SULFATE TREATMENT LIQUID CONTAINING SULFATE-METALLATES
METHOD FOR ELECTROLYTIC SURFACE MODIFICATION OF FLAT METAL WORKPIECES IN COPPER-SULFATE TREATMENT LIQUID CONTAINING SULFATE-METALLATES
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机译：含硫酸金属铜的硫酸铜处理液中扁平金属工件的电解表面改性方法
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摘要
The invention relates to a method for the electrolytic surface modification of a flat workpiece by the deposition of copper aggregates. The invention also relates to flat metal workpieces that can be produced using this method and to the use of said metal workpieces as substrates for the formation of secure adhesive bonds comprising a plurality of materials.
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