ADHESIVE, THE PRECURSOR OF WHICH IS APPLIED IN LIQUID FORM AND UV-POLYMERIZED, FOR ENCAPSULATING FLEXIBLE ELECTRONIC DEVICES, IMPROVING THE PROTECTION AGAINST GAS PERMEABILITY

摘要

The invention relates to a process for encapsulating a flexible electronic device with at least one flexible sheet that protects against orthogonal gas permeation, by means of an adhesive that protects against lateral gas permeation, the process comprising: a step of applying a layer of a polymerizable precursor of the adhesive that protects against lateral gas permeation, to the surface of the device and/or to the surface of the flexible gas-protection sheet, comprising oligomers with reactive double bonds of (meth)acrylic, vinyl, allyl or unsaturated polyester type, and preferably of (meth)acrylic type and a polymerization initiator, a step of polymerizing the acrylic precursor applied, when it is positioned between the device and the gas-protection sheet, in order to form the adhesive that attaches the protective sheet to the device while protecting this device from lateral gas permeation.