首页> 外国专利> EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

EMI FILTERED CO-CONNECTED HERMETIC FEEDTHROUGH, FEEDTHROUGH CAPACITOR AND LEADWIRE ASSEMBLY FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

机译:有源可植入医疗设备的EMI滤波共联全密封馈电,馈电电容器和引线装配

摘要

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
机译:密闭馈通,馈通电容器和引线组件的共同连接包括介电基板,该介电基板具有从体液侧到装置侧穿过介电基板设置的通孔。导电填充物布置在通孔内,形成气密密封,并且在体液侧和装置侧之间导电。馈通电容器附接到电介质基板,并且包括电容器电介质基板,包括内部金属化层的未填充电容器通孔,电耦合到内部金属化层的一组电容器有源电极板,设置的外部金属化层和电容器接地的集合电极板电耦合到外部金属层。导电引线布置在未填充的电容器通孔内。电接头将导电填充物,电容器内部金属化层以及电容器有源电极板和导电引线连接起来。

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