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LASER PROCESSING MACHINE, LASER PROCESSING METHOD, BOARD MATERIAL PROCESSING SYSTEM, AND BOARD MATERIAL PROCESSING METHOD

机译:激光加工机,激光加工方法,板材料加工系统以及板材料加工方法

摘要

[Problem] Provided is a laser machine and laser machining method that are able to transfer a workpiece easily and efficiently by allowing a workpiece rack with the workpiece placed thereon to be raised and lowered.;[Solving Means] A laser machine includes a laser head 4 that machines a planar workpiece W located in a machining region R1 while moving relative to the workpiece W, a workpiece rack 6 that is able to travel while having the workpiece W placed thereon, and an elevator 2 that is able to locate the workpiece W in the machining region by raising and lowering the workpiece rack 6 with the workpiece W placed thereon.
机译:[问题]提供了一种激光机和激光加工方法,该激光机和激光加工方法能够通过使放置有其上的工件的工件架升降来容易且有效地传送工件。[解决手段]一种包括激光头的激光机。参照图4,该平面工件W在相对于工件W运动的同时加工位于加工区域R1中的平面工件W,在其上放置有工件W的同时能够行进的工件架6以及能够定位工件W的升降机2。通过在其上放置有工件W的工件架6的升降来在加工区域中移动工件。

著录项

  • 公开/公告号EP3318363A1

    专利类型

  • 公开/公告日2018-05-09

    原文格式PDF

  • 申请/专利权人 MURATA MACHINERY LTD.;

    申请/专利号EP20160821077

  • 发明设计人 OZEKI KOJI;

    申请日2016-04-13

  • 分类号B23K26/10;B21D43/10;B23P23;B30B13;

  • 国家 EP

  • 入库时间 2022-08-21 13:14:47

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