HEAT DISSIPATION STRUCTURE OF BOARD UNIT FOR ELECTRONIC APPARATUS ENCLOSURE AND ASSEMBLING METHOD OF HEAT DISSIPATION SHEET IN HEAT DISSIPATION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a board unit for an electronic apparatus enclosure capable of improving work efficiency during component assembly work, while improving electrothermal performance.SOLUTION: A heat dissipation structure of a board unit for an electronic apparatus enclosure of an indirect air-cooling system includes a heat dissipation cover, and a screw type heat path structure placed at a position in the heat dissipation cover corresponding to an electric component on an electronic circuit board. The screw type heat path structure includes a screw hole of the heat dissipation cover, a screw member screwing into the screw hole, a pushing member for temporary assembly pushing the electric component, and a heat dissipation sheet being assembled to the electric component while pushing, in place of the pushing member. The heat dissipation sheet is installed by coupling the heat dissipation sheet to a tip of the screw member, in place of the pushing member, in a temporary assembly state where the screw member is screwed into the screw hole, and the pushing member is screwed into a position abutting on the electric component.SELECTED DRAWING: Figure 4