ADSORPTION CONFIRMATION METHOD, DESORPTION CONFIRMATION METHOD, AND DECOMPRESSION PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To easily confirm whether or not an electrostatic chuck adsorbs a wafer.SOLUTION: An electrostatic chuck 3 comprises: a wafer holding unit 31 that is formed using a dielectric substance, has a holding surface, and includes a metal plate 34 disposed inside; and first wiring 37 connecting the metal plate 34 to a DC power supply 36. Transportation means 7 comprises: a pad 70 for holding a wafer using a holding surface formed using a conductor; and second wiring 72 connecting the pad 70 to the ground. On the first wiring 37 or the second wiring 72 is disposed voltage measurement means 8 including a resistor 81 and a voltage meter 84 for measuring voltage across both ends of the resistor 81. An adsorption confirmation method includes: a step of bringing a wafer held by the pad 70 into contact with the electrostatic chuck 3 to connect the electrostatic chuck 3 to the pad 70; and a step of supplying power from the DC power supply 36 to the electrostatic chuck 3 to determine that the electrostatic chuck 3 adsorbs the wafer when the measurement value by the voltage meter 84 of voltage in a direction in which the power is supplied to the electrostatic chuck 3 reaches a predetermined voltage value.SELECTED DRAWING: Figure 1