首页> 外国专利> Method for measuring deposition rate and deposition rate control system

Method for measuring deposition rate and deposition rate control system

机译:沉积速率的测量方法及沉积速率控制系统

摘要

A method (100) for measuring the deposition rate of an evaporated material is described. The method includes measuring a deposition rate (110) at a time interval T between a first measurement M 1 and a second measurement M 2 and adjusting a time interval T (120) depending on the measured deposition rate, . In addition, a deposition rate control system (200) is described. The deposition rate control system includes a deposition rate measurement assembly (210) for measuring the deposition rate of the evaporation material, a controller (220) coupled to the deposition rate measurement assembly (210) and the evaporation source (300) The controller is configured to provide a control signal to the deposition rate measurement assembly (210).(FIG.
机译:描述了一种用于测量蒸发材料的沉积速率的方法(100)。该方法包括在第一测量值M 1和第二测量值M 2之间的时间间隔T处测量沉积速率(110),并根据所测量的沉积速率来调整时间间隔T(120)。另外,描述了沉积速率控制系统(200)。沉积速率控制系统包括:沉积速率测量组件(210),用于测量蒸发材料的沉积速率;控制器(220),其耦合至沉积速率测量组件(210);以及蒸发源(300)。以向沉积速率测量组件(210)提供控制信号。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号