首页> 外国专利> RESIN COMPOSITION FOR ENCAPSULATION OF CAPACITANCE TYPE SENSOR AND CAPACITANCE TYPE SENSOR

RESIN COMPOSITION FOR ENCAPSULATION OF CAPACITANCE TYPE SENSOR AND CAPACITANCE TYPE SENSOR

机译:用于电容型传感器和电容型传感器封装的树脂组合物

摘要

PROBLEM TO BE SOLVED: To provide a resin composition with which a capacitance type sensor having no defects in the appearance can be manufactured with a high yield, and a capacitance type sensor having excellent sensitivity.SOLUTION: A resin composition for encapsulation of a capacitance type sensor of the present invention is a resin composition to be used to form an encapsulation film in a capacitance type sensor. The resin composition comprises an epoxy resin, a curing agent and a filler; and a test piece made of the resin composition for encapsulation of a capacitance type sensor, prepared under the following condition 1 shows a shrinkage percentage of less than 0.19%. (Condition 1) The test piece is a cured product obtained by heat-treating the resin composition for encapsulation of a capacitance type sensor at 175°C for 2 minutes and then heat-treating the resin composition at 175°C for 4 hours.SELECTED DRAWING: None
机译:解决的问题:提供一种树脂组合物,利用该树脂组合物可以高产量地制造外观上没有缺陷的电容型传感器,以及具有优异灵敏度的电容型传感器。解决方案:用于封装电容型的树脂组合物本发明的传感器是用于在电容型传感器中形成封装膜的树脂组合物。该树脂组合物包含环氧树脂,固化剂和填料;和在以下条件1下制备的由用于封装型电容式传感器的树脂组合物制成的试件的收缩率小于0.19%。 (条件1)测试片是通过将用于封装型电容式传感器的树脂组合物在175℃下热处理2分钟,然后在175℃下热处理4小时而获得的固化产物。绘图:无

著录项

  • 公开/公告号JP2018053240A

    专利类型

  • 公开/公告日2018-04-05

    原文格式PDF

  • 申请/专利权人 SUMITOMO BAKELITE CO LTD;

    申请/专利号JP20170159319

  • 发明设计人 TABEI JUNICHI;

    申请日2017-08-22

  • 分类号C08G59/20;C09K3/10;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-21 13:11:35

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