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RESIN COMPOSITION FOR ENCAPSULATION OF CAPACITANCE TYPE SENSOR AND CAPACITANCE TYPE SENSOR
RESIN COMPOSITION FOR ENCAPSULATION OF CAPACITANCE TYPE SENSOR AND CAPACITANCE TYPE SENSOR
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机译:用于电容型传感器和电容型传感器封装的树脂组合物
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摘要
PROBLEM TO BE SOLVED: To provide a resin composition with which a capacitance type sensor having no defects in the appearance can be manufactured with a high yield, and a capacitance type sensor having excellent sensitivity.SOLUTION: A resin composition for encapsulation of a capacitance type sensor of the present invention is a resin composition to be used to form an encapsulation film in a capacitance type sensor. The resin composition comprises an epoxy resin, a curing agent and a filler; and a test piece made of the resin composition for encapsulation of a capacitance type sensor, prepared under the following condition 1 shows a shrinkage percentage of less than 0.19%. (Condition 1) The test piece is a cured product obtained by heat-treating the resin composition for encapsulation of a capacitance type sensor at 175°C for 2 minutes and then heat-treating the resin composition at 175°C for 4 hours.SELECTED DRAWING: None
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