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Thermal interface materials using metal nanowire arrays and sacrificial templates

机译:使用金属纳米线阵列和牺牲模板的热界面材料

摘要

A method of making a thermal interface material (TIM) includes depositing a seed layer on a substrate, attaching a template film to the substrate, depositing a metal in one or more of the holes in the template film, Substantially filling the template film to form a vertically aligned metal nanowire (MNW) array comprising a plurality of nanowires growing upward from the seed layer, and the template film substantially filled with deposited metal Thereafter, the method includes a step of removing the template film, leaving a plurality of nanowires attached to the seed layer. The TIM comprises an MNW array comprising a plurality of nanowires that grow upward from a seed layer deposited on the surface of the template film, the template film being removed after the MNW growth. [Selection] Figure 1
机译:一种制造热界面材料(TIM)的方法,包括在基板上沉积种子层,将模板膜附着到基板,在模板膜中的一个或多个孔中沉积金属,基本上填充模板膜以形成垂直排列的金属纳米线(MNW)阵列,其中包括从种子层向上生长的多条纳米线,并且模板膜基本填充有沉积的金属。此后,该方法包括以下步骤:去除模板膜,使多条纳米线附着在种子层。 TIM包括MNW阵列,该MNW阵列包括从沉积在模板膜的表面上的种子层向上生长的多个纳米线,该模板膜在MNW生长之后被去除。 [选择]图1

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