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Joining strength test apparatus for electronic parts and bonding strength test method
Joining strength test apparatus for electronic parts and bonding strength test method
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机译:电子零件的接合强度试验装置及接合强度试验方法
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摘要
According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.
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