首页> 外国专利> Joining strength test apparatus for electronic parts and bonding strength test method

Joining strength test apparatus for electronic parts and bonding strength test method

机译:电子零件的接合强度试验装置及接合强度试验方法

摘要

According to an embodiment, a bonding strength test device measures bonding strength between a flexure of a suspension of a hard disk drive and microactuators mounted on a gimbal of the flexure. The bonding strength test device includes a clamp, dummy, and device body. The clamp fixes the flexure. The dummy is adhered to the microactuators. The probe is engaged in the dummy. The device body measures a tensile load applied to the probe while the probe is pulled toward a direction to be apart from the flexure.
机译:根据一个实施例,结合强度测试装置测量硬盘驱动器的悬架的挠曲与安装在该挠性万向架上的微致动器之间的结合强度。粘结强度测试设备包括夹具,假人和设备主体。夹具固定挠曲。假人粘附到微致动器上。探针插入假人。当将探针向远离弯曲部分的方向拉动时,设备主体会测量施加到探针的拉伸载荷。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号