Plating solution for use in lead frame or substrate for light emitting device, lead frame or substrate manufactured using the same, light emitting device including the same

摘要

PROBLEM TO BE SOLVED: To provide a silver or silver alloy plating solution which makes it possible to obtain a higher total luminous flux of a light emitting device as compared with conventional one.SOLUTION: A plating solution of the invention is a silver or silver alloy plating solution used for plating of a lead frame or substrate for a light emitting device, at least comprising 0.1 g/L or more and 15 g/L or less of a silver cyanide complex and 50 g/L or more and 250 g/L or less of an electrical conductive salt, and having a pH of 8 or more and 13.5 or less and a deposition efficiency of 0.5% or more and 50% or less.