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Radiating fin, manufacturing method of heat dissipating fin, and semiconductor package including radiating fin

机译:散热鳍片,散热鳍片的制造方法以及包括该散热鳍片的半导体封装

摘要

According to the present invention, there is provided a molded article comprising a papermaking molded article containing a thermosetting resin, a fibrous filler composed of at least one of carbon fibers and metal fibers, and a powdery filler composed of a carbon material A material containing a thermosetting resin, a fibrous filler composed of at least one of carbon fiber and metal fiber, and a powdered filler composed of a carbon material by using a heat radiation fin and a paper making method And a step of producing a sheet-formed article from the slurry, and a step of forming the sheet-formed article under heat and pressure so as to produce a heat-radiating fin constituted of a sheet-formed article.
机译:根据本发明,提供了一种模制品,其包括:造纸模制品,其包含热固性树脂;由碳纤维和金属纤维中的至少一种构成的纤维状填料;以及由碳材料构成的粉末状填料。热固性树脂,由碳纤维和金属纤维中的至少一种构成的纤维状填料,以及通过使用散热片和由碳材料构成的粉末状填料以及造纸方法和由该方法制造片状制品的步骤浆料和在加热和加压下形成片状制品的步骤,以生产由片状制品构成的散热片。

著录项

  • 公开/公告号JPWO2017061307A1

    专利类型

  • 公开/公告日2018-08-02

    原文格式PDF

  • 申请/专利权人 住友ベークライト株式会社;

    申请/专利号JP20170544462

  • 发明设计人 杉野 遼介;谷口 享起;

    申请日2016-09-27

  • 分类号H01L23/373;

  • 国家 JP

  • 入库时间 2022-08-21 13:07:18

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