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Radiating fin, manufacturing method of heat dissipating fin, and semiconductor package including radiating fin
Radiating fin, manufacturing method of heat dissipating fin, and semiconductor package including radiating fin
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机译:散热鳍片,散热鳍片的制造方法以及包括该散热鳍片的半导体封装
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摘要
According to the present invention, there is provided a molded article comprising a papermaking molded article containing a thermosetting resin, a fibrous filler composed of at least one of carbon fibers and metal fibers, and a powdery filler composed of a carbon material A material containing a thermosetting resin, a fibrous filler composed of at least one of carbon fiber and metal fiber, and a powdered filler composed of a carbon material by using a heat radiation fin and a paper making method And a step of producing a sheet-formed article from the slurry, and a step of forming the sheet-formed article under heat and pressure so as to produce a heat-radiating fin constituted of a sheet-formed article.
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