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Undercoat agent for substrate with copper thin film, substrate with copper thin film and method for producing the same, and conductive film and electrode film
Undercoat agent for substrate with copper thin film, substrate with copper thin film and method for producing the same, and conductive film and electrode film
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机译:具有铜薄膜的基板的底涂层剂,具有铜薄膜的基板及其制造方法,以及导电膜和电极膜
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摘要
PROBLEM TO BE SOLVED: To provide a composition which is an organic polymer-based undercoat agent used for manufacturing a substrate with a copper thin film and capable of forming an undercoat layer excellent in not only initial adhesiveness between a plastic substrate and the copper thin film, but also adhesiveness after an alkali treatment and adhesiveness after an acid treatment.SOLUTION: There is provided an undercoat agent for substrate with copper thin film containing (A) acrylic copolymer by reacting hydroxyl group-containing (meth)acrylate (a1) and alkyl (meth)acrylate (a2), (B) a polyisocyanate-based curing agent having at least three isocyanate groups and (C) a silane coupling agent.
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