首页> 外国专利> Undercoat agent for substrate with copper thin film, substrate with copper thin film and method for producing the same, and conductive film and electrode film

Undercoat agent for substrate with copper thin film, substrate with copper thin film and method for producing the same, and conductive film and electrode film

机译:具有铜薄膜的基板的底涂层剂,具有铜薄膜的基板及其制造方法,以及导电膜和电极膜

摘要

PROBLEM TO BE SOLVED: To provide a composition which is an organic polymer-based undercoat agent used for manufacturing a substrate with a copper thin film and capable of forming an undercoat layer excellent in not only initial adhesiveness between a plastic substrate and the copper thin film, but also adhesiveness after an alkali treatment and adhesiveness after an acid treatment.SOLUTION: There is provided an undercoat agent for substrate with copper thin film containing (A) acrylic copolymer by reacting hydroxyl group-containing (meth)acrylate (a1) and alkyl (meth)acrylate (a2), (B) a polyisocyanate-based curing agent having at least three isocyanate groups and (C) a silane coupling agent.
机译:解决的问题:提供一种组合物,该组合物是用于制造具有铜薄膜的基板的有机聚合物基底涂层剂,并且能够形成不仅在塑料基板和铜薄膜之间的初始粘附性优异的底涂层。解决方案:提供一种用于含铜薄膜的基材的底涂剂,该底涂剂通过使含羟基的(甲基)丙烯酸酯(a1)与烷基反应而含有(A)丙烯酸共聚物的铜薄膜。 (甲基)丙烯酸酯(a2),(B)具有至少三个异氰酸酯基的多异氰酸酯基固化剂和(C)硅烷偶联剂。

著录项

  • 公开/公告号JP6241677B2

    专利类型

  • 公开/公告日2017-12-06

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20150074613

  • 发明设计人 山崎 彰寛;東本 徹;

    申请日2015-03-31

  • 分类号C09D133/14;C09D133/06;C08J7/04;C09D133/20;C09D133/26;C09D7/12;C09D5;H01B5/14;B32B15/082;B32B27/30;

  • 国家 JP

  • 入库时间 2022-08-21 13:06:42

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