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Mold temperature control device and mold temperature control method

机译:模具温度控制装置及模具温度控制方法

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for mold temperature adjustment which can reduce deposition of scale in a conduit line through which a cooling medium for cooling a temperature adjustment medium flows.SOLUTION: A mold temperature adjustment device 1 supplies a temperature adjustment medium to a medium passage 4 provided in a mold 3 in a circulating manner and includes a heat exchanger 30 which has a cooling path 32 always causing the cooling medium to flow through in a stationary operation state of the mold temperature adjustment device and a medium path 31 causing the temperature medium heat-exchanged indirectly by the cooling path to flow through and a control part 34 making the medium path to conduct a control of flowing the temperature adjustment medium in cooling the temperature adjustment medium.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种用于模具温度调节的装置和方法,该装置和方法可以减少在冷却冷却温度调节介质的冷却介质流过的管道中的水垢沉积。解决方案:模具温度调节装置1提供温度。调节介质以循环方式到达设置在模具3中的介质通道4,并包括热交换器30,该热交换器30具有始终使冷却介质在模具温度调节装置的静止操作状态下流过的冷却路径32使通过冷却路径间接进行热交换的温度介质流过的通道31和使介质通道进行控制的控制部分34在冷却温度调节介质时进行温度调节介质的流动控制。图1

著录项

  • 公开/公告号JP6257467B2

    专利类型

  • 公开/公告日2018-01-10

    原文格式PDF

  • 申请/专利权人 株式会社松井製作所;

    申请/专利号JP20140153928

  • 发明设计人 目次 正明;

    申请日2014-07-29

  • 分类号B29C33/04;B29C45/73;

  • 国家 JP

  • 入库时间 2022-08-21 13:06:36

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