首页> 外国专利> Hydrogenated block copolymer, polypropylene resin composition using the same, and molded product thereof

Hydrogenated block copolymer, polypropylene resin composition using the same, and molded product thereof

机译:氢化嵌段共聚物,使用该嵌段共聚物的聚丙烯树脂组合物及其成型品

摘要

The present invention is a hydrogenated block copolymer having in its molecule a polymer block (S) mainly composed of vinyl aromatic compound units and a polymer block (B) mainly composed of conjugated diene compound units. In the hydrogenated block copolymer, the content of the polymer block (S) is 5 to 20% by mass, the content of the polymer block (B) is 80 to 95% by mass, The polymer block (B) includes a polymer block (B1) and a polymer block (B2), the amount of vinyl bonds before hydrogenation of the polymer block (B1) is 30 to 60 mol%, The amount of vinyl bonds before hydrogenation of the combined block (B2) is more than 60 to 100 mol%, and the content of the polymer block (B1) in the hydrogenated block copolymer is 5 to 60% by mass. , The polymer block (B ) Is 30 to 85% by mass, and in the hydrogenated block copolymer, the content of the structure represented by the following formula (1) is 40 to 100% by mass. Provided is a hydrogenated block copolymer having a hydrogenation rate of 70% by mole or more. (SB) ... Formula (1) (In Formula (1), S means a polymer block (S) and B means a polymer block (B).)
机译:本发明是一种氢化嵌段共聚物,其分子内具有主要由乙烯基芳族化合物单元组成的聚合物嵌段(S)和主要由共轭二烯化合物单元组成的聚合物嵌段(B)。氢化嵌段共聚物中,聚合物嵌段(S)的含量为5〜20质量%,聚合物嵌段(B)的含量为80〜95质量%,聚合物嵌段(B)包括聚合物嵌段。 (B1)和聚合物嵌段(B2)中,聚合物嵌段(B1)的氢化前的乙烯基键的量为30〜60摩尔%,组合嵌段(B2)的氢化前的乙烯基键的量为60以上。氢化嵌段共聚物中的聚合物嵌段(B1)的含量为5〜60质量%。聚合物嵌段(B)为30〜85质量%,氢化嵌段共聚物中,下述式(1)表示的结构的含量为40〜100质量%。提供氢化率为70摩尔%以上的氢化嵌段共聚物。 (SB)...式(1)(式(1)中,S是聚合物嵌段(S),B是聚合物嵌段(B)。)

著录项

  • 公开/公告号JPWO2017033987A1

    专利类型

  • 公开/公告日2018-03-01

    原文格式PDF

  • 申请/专利权人 旭化成株式会社;

    申请/专利号JP20170536471

  • 申请日2016-08-24

  • 分类号C08F297/04;C08L23/10;C08L53/02;C08F8/04;C08F212/08;C08F236/06;

  • 国家 JP

  • 入库时间 2022-08-21 13:06:31

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