Stack heat dissipation structure and power conversion device including stack having the stack heat dissipation structure

摘要

A capacitor is mounted at the center of the printed circuit board, and semiconductor devices are mounted on both sides of the printed circuit board. The heat sink includes a first heat sink having a shape having short fins and long fins according to the outer shape of the capacitor, and a second heat sink having the same shape as the first heat sink and facing each other with the fins facing each other. Composed. A heat dissipation sheet for heat dissipation is provided between the heat sink and the semiconductor device. With this configuration, a stack heat dissipation structure that can suppress the temperature rise of the capacitor and the heat sink and can realize downsizing of the stack and a power conversion device including the stack having the stack heat dissipation structure are provided. be able to.