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Headphone response measurement and equalization

机译:耳机响应测量和均衡

摘要

An apparatus for evaluating performance of a headphone assembly is provided with a base and a support having a proximal end extending from the base. The support includes a distal end that is adapted for supporting a headphone assembly, and the support includes a pair of opposing sides that are laterally spaced apart. The apparatus also includes a pair of plates and at least two microphones. Each plate is mounted to one of the opposing sides of the support, and includes a central portion with at least two apertures formed therein. The central portion is sized for receiving a headphone of the headphone assembly. Each microphone is disposed within one of the apertures and arranged such that an outer surface of the microphone is oriented substantially parallel to an outer surface of the plate and adapted for receiving sound emitted from the headphone.
机译:一种用于评估耳机组件的性能的设备,其具有底座和具有从底座延伸的近端的支架。所述支撑件包括适于支撑耳机组件的远端,并且所述支撑件包括在横向上间隔开的一对相对的侧面。该设备还包括一对板和至少两个麦克风。每个板安装到支撑件的相对侧之一,并且包括中心部分,该中心部分具有形成在其中的至少两个孔。中央部分的尺寸适于容纳耳机组件的耳机。每个麦克风被布置在孔之一内并且被布置成使得麦克风的外表面被定向为基本上平行于板的外表面并且适于接收从耳机发出的声音。

著录项

  • 公开/公告号US10104485B2

    专利类型

  • 公开/公告日2018-10-16

    原文格式PDF

  • 申请/专利权人 HARMAN INTERNATIONAL INDUSTRIES INC.;

    申请/专利号US201615351109

  • 发明设计人 ULRICH HORBACH;

    申请日2016-11-14

  • 分类号H04R29;H04R3/04;H04R5/033;G06F3/16;

  • 国家 US

  • 入库时间 2022-08-21 13:06:13

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