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INTEGRATED CARD RAIL AND COOLING MODULE FOR EMBEDDED COMPUTING SYSTEMS
INTEGRATED CARD RAIL AND COOLING MODULE FOR EMBEDDED COMPUTING SYSTEMS
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机译:嵌入式计算机系统的集成卡轨和冷却模块
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摘要
A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.
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