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THERMOSETTING SILICONE RESIN COMPOSITION CONTAINING BORON NITRIDE, DISPERSANT FOR SILICONE RESIN COMPOSITIONS, AND INORGANIC FILLER
THERMOSETTING SILICONE RESIN COMPOSITION CONTAINING BORON NITRIDE, DISPERSANT FOR SILICONE RESIN COMPOSITIONS, AND INORGANIC FILLER
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机译:包含氮化硼,硅树脂组合物分散剂和无机填料的热固硅树脂组合物
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摘要
The present invention provides: 1) a silicone resin composition, containing: a thermosetting silicone resin; an inorganic substance; and a dispersant, in which: the dispersant includes a copolymer of a (meth)acrylic acid ester having at least one polydimethylsiloxane structure and a (meth)acrylic acid alkyl ester; and the inorganic substance is boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride; 2) a dispersant for a boron nitride-containing silicone resin composition, comprising the above-mentioned copolymer; and 3) an inorganic filler, comprising boron nitride or a mixture of the boron nitride and an inorganic substance except the boron nitride. The silicone resin composition of the present invention has a low viscosity and has stability against a mechanochemical treatment.
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