LEAD TIP POSITION IMAGE RECOGNITION METHOD AND LEAD TIP POSITION IMAGE RECOGNITION SYSTEM

摘要

An electronic component picked up and held by a mounting head of a component mounter is moved to an imaging position above a component imaging camera, the tip of the lead of the electronic component is imaged from below by the camera to acquire a lead image, and the lead image is inputted into an image recognition device configured from a neural network or the like and imaged processed so as to output the center position of the tip of the lead. Here, whenever an image processing error occurs, the lead image for which the image processing error occurred is displayed on a display device, and an operator specifies the center position of the tip of the lead in the lead image display on the display device and the specified center position is inputted into the image recognition device.