首页> 外国专利> DEEP EPI ENABLED BY BACKSIDE REVEAL FOR STRESS ENHANCEMENT amp; CONTACT

DEEP EPI ENABLED BY BACKSIDE REVEAL FOR STRESS ENHANCEMENT amp; CONTACT

机译:通过背面显示实现深度EPI,以增强应力和接触

摘要

Embodiments of the invention include a non-planar transistor with a strained channel and methods of forming such a transistor. In an embodiment, the non-planar transistor may include a semiconductor substrate. According to an embodiment, a first source/drain (S/D) region and a second S/D region may be formed over the semiconductor substrate and separated from each other by a channel region. A gate stack may be formed over the channel region. In order to increase the amount of strain that may be induced in the channel region, embodiments may include forming a strain enhancement opening in the semiconductor substrate that removes at least a portion of the semiconductor substrate from below the channel region.
机译:本发明的实施例包括具有应变沟道的非平面晶体管以及形成这种晶体管的方法。在一个实施例中,非平面晶体管可以包括半导体衬底。根据一个实施例,第一源/漏(S / D)区域和第二S / D区域可以形成在半导体衬底上方并且通过沟道区域彼此分离。栅极叠层可以形成在沟道区上方。为了增加可能在沟道区中引起的应变的量,实施例可以包括在半导体衬底中形成应变增强开口,该应变增强开口从沟道区下方去除半导体衬底的至少一部分。

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