A bus line LED module includes a printed circuit board on which LEDs are mounted and lens portion formed over the LEDs. A pair of wires is positioned beneath the printed circuit board within a bottom portion assembly to form a top portion assembly. A pair of windows within a bottom portion assembly enables access to a portion of the wires where a metal-to-metal contact to the metal inner portion of the wires is made. A pair of metal connectors extends from the printed circuit board to make metal-to-metal contact with the metal wires. A sealing connection is made between the top portion assembly and the bottom portion assembly.
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