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SURFACE TREATMENT METHOD FOR TRANSPARENT RESIN FORMING MOLD, TRANSPARENT RESIN FORMING MOLD, AND TRANSPARENT RESIN FORMED ARTICLE
SURFACE TREATMENT METHOD FOR TRANSPARENT RESIN FORMING MOLD, TRANSPARENT RESIN FORMING MOLD, AND TRANSPARENT RESIN FORMED ARTICLE
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机译：透明树脂成型模，透明树脂成型模和透明树脂成型制品的表面处理方法
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摘要
A method of treating a surface of a mold for transparent resin molding. The method includes ejecting substantially spherical ejection particles against a surface of a mold employed to mold a transparent resin so as to bombard the surface. The method includes forming dimples with an equivalent diameter in a range that satisfies a condition defined by the following formula:; 1+3.3e−H/230≤W≤1.5+8.9e−H/630 ;wherein W is an equivalent diameter (μm) of the dimples and H is a base metal hardness (Hv) of the mold.
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机译：一种处理用于透明树脂成型的模具表面的方法。该方法包括将大体上球形的喷射颗粒喷射到用于模制透明树脂的模具表面上，以轰击该表面。该方法包括形成等效直径在满足下式定义的条件的范围内的凹坑： <？in-line-formulae description =“在线公式” end =“ lead”？> 1 + 3.3 e -H / 230 ≤W< /I>≤1.5+8.9e-H/630 <？in-line-formulae description =“ In-line Formulae” end =“ tail”？>;其中W是凹痕的等效直径（μm），H是模具的贱金属硬度（Hv）。
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