Method for separation of micro/nano-electronic elements and micro/nano-mechanical elements from carrier plates

摘要

the object of the application is the separation of micro / nano - way electronic and micro / nano mechanical structures or in the form of platelets from platelet launchwhich are assembled temporarily through layers of polymeric binders for various technological processes.in this manner, before the start of the operation technologythe elements of micro / nano - or micro / nano electronic mechanical technology with such elements or plates connected by polymeric binders with the perforated plate carrier.when connecting elements tends to position such that in each of them is located at least one opening plate superstructure.after the whole operation technology is subjected to the action of plasma trawiu0105cej spoinu0119 polymer.