Described herein are quantum integrated circuit (IC) assemblies that include quantum circuit components comprising a plurality of qubits and control logic coupled to the quantum circuit components and configured to control operation of those components, where the quantum circuit component(s) and the control logic are provided on a single die. By implementing control logic on the same die as the quantum circuit component(s), more functionality can be provided on-chip, thus integrating more of signal chain on-chip. Integration can greatly reduce complexity and lower the cost of quantum computing devices, reduce interfacing bandwidth, and provide an approach that can be efficiently used in large scale manufacturing. Methods for fabricating such assemblies are also disclosed.
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