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FACILITATION OF SPIN-COAT PLANARIZATION OVER FEATURE TOPOGRAPHY DURING SUBSTRATE FABRICATION
FACILITATION OF SPIN-COAT PLANARIZATION OVER FEATURE TOPOGRAPHY DURING SUBSTRATE FABRICATION
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机译:在基材制造过程中方便进行地形图上的旋转涂层规划
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摘要
Described herein are technologies to facilitate device fabrication, especially those that involve spin-on coatings of a substrate (e.g., wafer). More particularly, technologies described herein facilitate the planarization (i.e., flatness) of spin-on coatings during the device fabrication to form a uniformly planar film or layer on the substrate. This abstract itself is not intended to limit the scope of this patent. The scope of the present invention is pointed out in the appending claims.
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