首页> 外国专利> METHODS OF CO-BONDING A FIRST THERMOSET COMPOSITE AND A SECOND THERMOSET COMPOSITE TO DEFINE A CURED COMPOSITE PART

METHODS OF CO-BONDING A FIRST THERMOSET COMPOSITE AND A SECOND THERMOSET COMPOSITE TO DEFINE A CURED COMPOSITE PART

机译:结合第一个热固性复合材料和第二个热固性复合材料来定义固化复合材料部件的方法

摘要

Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
机译:本文公开了共键合第一热固性复合材料(TSC)和第二TSC以限定固化的复合材料零件的方法。该方法包括将第一TSC部分固化至目标固化状态(SOC)以限定第一部分固化的TSC。部分固化至少部分地基于在部分固化期间第一TSC的最高温度以及第一TSC的实际温度大于阈值温度的经过时间。该方法进一步包括将第一部分固化的TSC与第二TSC组合以限定部分固化的TSC组件,并加热该部分固化的TSC组件以将第一部分固化的TSC结合至第二TSC,固化该部分固化的TSC组件,并产生固化的复合材料零件。

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