Hybrid semiconductor package controlling radius of curvature by adjusting rigidity of mold

摘要

The hybrid package of the present invention comprises: a flexible strip substrate which is bent upward and downward; a flexible strip substrate which is mounted on the flexible strip substrate at a first height (h1) and has a first hardness (r1) And a second hardness r2 smaller than the first hardness r1, the second hardness being smaller than the first hardness r1, the second hardness being smaller than the first hardness. And a first flexible package. According to the configuration of the present invention, the radius of curvature can be kept constant even when the environment of the mounted component is different.